Invention Grant
- Patent Title: Electrostatic chuck and semiconductor manufacturing apparatus
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Application No.: US17469159Application Date: 2021-09-08
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Publication No.: US11756820B2Publication Date: 2023-09-12
- Inventor: Akihito Ono , Jumpei Uefuji
- Applicant: TOTO LTD.
- Applicant Address: JP Kitakyushu
- Assignee: Toto Ltd.
- Current Assignee: Toto Ltd.
- Current Assignee Address: JP Fukuoka
- Agency: Carrier, Shende & Associates P.C.
- Agent Joseph P. Carrier; Fulchand P. Shende
- Priority: JP 20162186 2020.09.28 JP 21050164 2021.03.24
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01T23/00 ; H01J37/32 ; H05B3/28 ; H05B1/02

Abstract:
An electrostatic chuck includes a ceramic dielectric substrate; a base plate; and a heater unit which heats the ceramic dielectric substrate. The heater unit includes first and second heater elements. The second heater element has a plurality of main zones separated from each other in a radial direction. The first heater element has a plurality of sub-zones separated from each other. A number of the sub-zones is larger than a number of the main zones. The main zones include a first main zone. The first main zone has a main heater line and a first main power feeding portion. The sub-zones include a first sub-zone overlapping the first main zone. The first sub-zone has a central region and an outer peripheral region. The first main power feeding portion is provided at a position where the first main power feeding portion overlaps the central region.
Public/Granted literature
- US20220102181A1 ELECTROSTATIC CHUCK AND SEMICONDUCTOR MANUFACTURING APPARATUS Public/Granted day:2022-03-31
Information query
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