Invention Grant
- Patent Title: High electron mobility transistor and method of manufacturing the same
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Application No.: US17719690Application Date: 2022-04-13
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Publication No.: US11757029B2Publication Date: 2023-09-12
- Inventor: Jaejoon Oh , Jongseob Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: HARNESS, DICKEY & PIERCE, P.L.C.
- Priority: KR 20200050342 2020.04.24
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/10 ; H01L29/423 ; H01L29/45 ; H01L29/47 ; H01L29/66 ; H01L29/20 ; H01L29/205

Abstract:
Provided are a high electron mobility transistor and a method of manufacturing the high electron mobility transistor. The high electron mobility transistor includes a gate electrode provided on a depletion forming layer. The gate electrode includes a first gate electrode configured to form an ohmic contact with the depletion forming layer, and a second gate electrode configured to form a Schottky contact with the depletion forming layer.
Public/Granted literature
- US20220238706A1 HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-07-28
Information query
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