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公开(公告)号:US20250169123A1
公开(公告)日:2025-05-22
申请号:US18745665
申请日:2024-06-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seong Seok Yang , Sanghyun Kim , Jongseob Kim , Joonyong Kim , Junhyuk Park , Jaejoon Oh , Jung-Wook Lee
Abstract: The present disclosure relates to semiconductor devices. An example semiconductor device includes a channel layer, a barrier layer on the channel layer including a material having a different energy band gap than a material included in the channel layer, a gate electrode on the barrier layer, a gate semiconductor layer between the barrier layer and the gate electrode, a protection layer on the barrier layer and the gate electrode, a source electrode and a drain electrode on both sides of the gate electrode and extending through the protection layer to cover the side surfaces of the channel layer and the barrier layer, and a diffusion barrier layer within the protection layer covering the barrier layer and the gate electrode and including Nitrogen.
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公开(公告)号:US11588046B2
公开(公告)日:2023-02-21
申请号:US17386729
申请日:2021-07-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongchul Shin , Boram Kim , Younghwan Park , Jongseob Kim , Joonyong Kim , Junhyuk Park , Jaejoon Oh , Minchul Yu , Soogine Chong , Sunkyu Hwang , Injun Hwang
IPC: H01L29/778 , H01L29/205 , H01L29/20
Abstract: A high electron mobility transistor (HEMT) includes a channel layer, a plurality of barrier layers, and a p-type semiconductor layer. The barrier layers have an energy band gap greater than that of the channel layer. A gate electrode is arranged on the p-type semiconductor layer. A source electrode and a drain electrode are apart from the p-type semiconductor layer and the gate electrode on the barrier layers. Impurity concentrations of the barrier layers are different from each other in a drift area between the source electrode and the drain electrode.
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公开(公告)号:US11335802B2
公开(公告)日:2022-05-17
申请号:US17016890
申请日:2020-09-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaejoon Oh , Jongseob Kim
IPC: H01L29/778 , H01L29/10 , H01L29/423 , H01L29/45 , H01L29/47 , H01L29/66 , H01L29/20 , H01L29/205
Abstract: Provided are a high electron mobility transistor and a method of manufacturing the high electron mobility transistor. The high electron mobility transistor includes a gate electrode provided on a depletion forming layer. The gate electrode includes a first gate electrode configured to form an ohmic contact with the depletion forming layer, and a second gate electrode configured to form a Schottky contact with the depletion forming layer.
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公开(公告)号:US12113110B2
公开(公告)日:2024-10-08
申请号:US17541735
申请日:2021-12-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Woochul Jeon , Jongseob Kim , Jaejoon Oh , Younghwan Park
IPC: H01L29/423 , H01L27/098 , H01L29/20 , H01L29/808
CPC classification number: H01L29/42316 , H01L27/098 , H01L29/808 , H01L29/2003
Abstract: A nitride semiconductor device having a field effect gate is disclosed. The disclosed nitride semiconductor device includes a high-resistance material layer including a Group III-V compound semiconductor, a first channel control layer on the high-resistance material layer and including a Group III-V compound semiconductor of a first conductivity type, a channel layer on the channel layer control layer and including a nitride semiconductor of a second conductivity type opposite to the first conductivity type, and a gate electrode having a contact of an ohmic contact type with the first channel control layer.
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公开(公告)号:US11387358B2
公开(公告)日:2022-07-12
申请号:US15931969
申请日:2020-05-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Younghwan Park , Jongseob Kim
IPC: H01L29/778 , H01L29/06 , H01L29/20 , H01L29/205 , H01L29/66 , H01L29/78
Abstract: A semiconductor structure includes a substrate; at least one mask layer spaced apart from the substrate in a first direction; a first semiconductor region of a first conductivity type between the substrate and the at least one mask layer; a second semiconductor region of a second conductivity type on the at least one mask layer; and a third semiconductor region of the first conductivity type on the first semiconductor region. The third semiconductor region may contact the second semiconductor region to form a PN-junction structure in a second direction different from the first direction. The semiconductor structure may be applied to vertical power devices and may be capable of increasing withstand voltage performance and lowering an on-resistance.
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公开(公告)号:US11227890B2
公开(公告)日:2022-01-18
申请号:US16885936
申请日:2020-05-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Younghwan Park , Jongseob Kim
IPC: H01L27/15
Abstract: A light-emitting device includes a first electrode layer; a second electrode layer; a third electrode layer separated from the first and second electrode layers; a multi-quantum well (MQW) layer between the first electrode layer and the second and third electrode layers; a first material layer between the first electrode layer and the MQW layer and doped with a first conductive type dopant; a second material layer between the second and third electrode layers and the MQW layer and doped with a second conductive type dopant; a gate insulating layer between the third electrode layer and the second material layer; and a current blocking layer configured to at least partially block a flow of a current between the second electrode layer and the MQW layer.
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公开(公告)号:US12199174B2
公开(公告)日:2025-01-14
申请号:US17537989
申请日:2021-11-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junhyuk Park , Sunkyu Hwang , Jongseob Kim , Joonyong Kim , Woochul Jeon
IPC: H01L29/778 , H01L21/02 , H01L23/29 , H01L23/31 , H01L29/20 , H01L29/205 , H01L29/66
Abstract: The present disclosure provides a high electron mobility transistor including a channel layer; a barrier layer on the channel layer and configured to induce formation of a 2-dimensional electron gas (2DEG) to the channel layer; a p-type semiconductor layer on the barrier layer; a first passivation layer on the barrier layer and including a quaternary material of Al, Ga, O, and N; a gate electrode on the p-type semiconductor layer; and a source electrode and a drain electrode provided on both sides of the barrier layer and separated from the gate electrode.
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公开(公告)号:US11757029B2
公开(公告)日:2023-09-12
申请号:US17719690
申请日:2022-04-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaejoon Oh , Jongseob Kim
IPC: H01L29/778 , H01L29/10 , H01L29/423 , H01L29/45 , H01L29/47 , H01L29/66 , H01L29/20 , H01L29/205
CPC classification number: H01L29/7787 , H01L29/10 , H01L29/42312 , H01L29/452 , H01L29/475 , H01L29/66462 , H01L29/2003 , H01L29/205
Abstract: Provided are a high electron mobility transistor and a method of manufacturing the high electron mobility transistor. The high electron mobility transistor includes a gate electrode provided on a depletion forming layer. The gate electrode includes a first gate electrode configured to form an ohmic contact with the depletion forming layer, and a second gate electrode configured to form a Schottky contact with the depletion forming layer.
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公开(公告)号:US11728419B2
公开(公告)日:2023-08-15
申请号:US17082478
申请日:2020-10-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Injun Hwang , Jaejoon Oh , Soogine Chong , Jongseob Kim , Joonyong Kim , Junhyuk Park , Sunkyu Hwang
IPC: H01L29/778 , H01L29/66 , H01L29/40 , H01L29/20
CPC classification number: H01L29/7786 , H01L29/2003 , H01L29/402 , H01L29/66462
Abstract: A high electron mobility transistor (HEMT) includes a channel layer comprising a group III-V compound semiconductor; a barrier layer comprising the group III-V compound semiconductor on the channel layer; a gate electrode on the barrier layer; a source electrode over gate electrode; a drain electrode spaced apart from the source electrode; and a metal wiring layer. A same layer of the metal wiring layer includes a gate wiring connected to the gate electrode, a source field plate connected to the source electrode, and a drain field plate connected to the drain electrode.
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公开(公告)号:US11581269B2
公开(公告)日:2023-02-14
申请号:US16868745
申请日:2020-05-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Younghwan Park , Jongseob Kim , Joonyong Kim , Junhyuk Park , Dongchul Shin , Jaejoon Oh , Soogine Chong , Sunkyu Hwang , Injun Hwang
IPC: H01L23/00 , H01L29/15 , H01L29/20 , H01L29/205 , H01L29/778
Abstract: A semiconductor thin film structure may include a substrate, a buffer layer on the substrate, and a semiconductor layer on the buffer layer, such that the buffer layer is between the semiconductor layer and the substrate. The buffer layer may include a plurality of unit layers. Each unit layer of the plurality of unit layers may include a first layer having first bandgap energy and a first thickness, a second layer having second bandgap energy and a second thickness, and a third layer having third bandgap energy and a third thickness. One layer having a lowest bandgap energy of the first, second, and third layers of the unit layer may be between another two layers of the first, second, and third layers of the unit layer.
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