Invention Grant
- Patent Title: UE capability for DMRS bundling
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Application No.: US17468172Application Date: 2021-09-07
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Publication No.: US11757592B2Publication Date: 2023-09-12
- Inventor: Jung Ho Ryu , Sony Akkarakaran , Tao Luo , Junyi Li , Peter Gaal , Xiaojie Wang , Wooseok Nam , Juan Montojo , Xiaoxia Zhang , Jing Sun , Mahmoud Taherzadeh Boroujeni , Piyush Gupta , Hua Wang , Lik Hang Silas Fong , Tianyang Bai , Yan Zhou
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza LLP
- Agent Sevan Savsa
- Main IPC: H04L5/00
- IPC: H04L5/00

Abstract:
Aspects relate to techniques for signaling the capability of a wireless communication device (e.g., a UE) to support demodulation reference signal (DMRS) bundling for channel estimation across two or more slots in the sidelink or uplink. In some examples, a transmitting UE may transmit a DMRS bundling indication to a receiving device (e.g., a receiving UE for sidelink DMRS bundling or a base station for uplink DMRS bundling). The DMRS bundling indication may indicate a capability of the transmitting UE to support DMRS bundling. The transmitting UE may then transmit a respective set of DMRSs within each of two or more slots during a DMRS bundling window to the receiving device based on the transmitting wireless communication device and the receiving device supporting DMRS bundling.
Public/Granted literature
- US20230073421A1 UE CAPABILITY FOR DMRS BUNDLING Public/Granted day:2023-03-09
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