- Patent Title: Printed circuit board and semiconductor module including the same
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Application No.: US17360417Application Date: 2021-06-28
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Publication No.: US11758652B2Publication Date: 2023-09-12
- Inventor: Dongyoon Seo , Geunje Park , Dohyung Kim , Hwanwook Park , Dongmin Jang , Jaeseok Jang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR 20200153621 2020.11.17
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18

Abstract:
A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.
Public/Granted literature
- US20220159832A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME Public/Granted day:2022-05-19
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