Bonded assembly of a memory die and a logic die including laterally shifted bit-line bonding pads and methods of forming the same
Abstract:
A bonded assembly of a memory die and a logic die is provided. The memory die includes a memory array, a plurality of bit lines, and memory-side bit-line-connection bonding pads. The logic die includes sense amplifiers located in a sense amplifier region, and logic-side bit-line-connection bonding pads located within the sense amplifier region and bonded to a respective one of the memory-side bit-line-connection bonding pads. The sense amplifier region has an areal overlap with a respective first subset the plurality of bit lines in a plan view, while a second subset of the plurality of bit lines does not have an areal overlap with the sense amplifier region in the plan view.
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