Invention Grant
- Patent Title: Ferroelectric random access memory devices and methods
-
Application No.: US17674422Application Date: 2022-02-17
-
Publication No.: US11758736B2Publication Date: 2023-09-12
- Inventor: Bo-Feng Young , Sai-Hooi Yeong , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H10B53/20 ; H01L29/66 ; H01L29/06 ; H01L27/092

Abstract:
A method of forming a semiconductor device includes: forming a first fin protruding above a substrate; forming first source/drain regions over the first fin; forming a first plurality of nanostructures over the first fin between the first source/drain regions; forming a first gate structure around the first plurality of nanostructures; and forming a first ferroelectric capacitor over and electrically coupled to the first gate structure.
Public/Granted literature
- US20220173115A1 Ferroelectric Random Access Memory Devices and Methods Public/Granted day:2022-06-02
Information query
IPC分类: