Invention Grant
- Patent Title: Covers for electronic devices
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Application No.: US17418464Application Date: 2019-02-01
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Publication No.: US11762427B2Publication Date: 2023-09-19
- Inventor: Kuan-Ting Wu , Ya-Ting Yeh , Chih-Hsiung Liao
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2019/016251 2019.02.01
- International Announcement: WO2020/159531A 2020.08.06
- Date entered country: 2021-06-25
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.
Public/Granted literature
- US20220066515A1 COVERS FOR ELECTRONIC DEVICES Public/Granted day:2022-03-03
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