公开(公告)号：US20210286234A1

公开(公告)日：2021-09-16

申请号：US16481509

申请日：2017-12-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Ya-Ting Yeh ,  Kuan-Ting Wu ,  Shih-Hsun Huang

IPC: G03B11/04 ,  G03B9/08 ,  G03B9/58 ,  G06F1/16 ,  H04N5/225

Abstract: Examples of shutter assembly are described herein. In an example, the shutter assembly includes an opening having a magnetic rubber-based shutter disposed in the opening. The magnetic rubber-based shutter is slidable along a length of the opening to selectively cover and expose the camera.

公开(公告)号：US20230189465A1

公开(公告)日：2023-06-15

申请号：US17997173

申请日：2020-05-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Chi Hao Chang

IPC: H05K5/03 ,  C09D5/00 ,  C09D7/41 ,  C09D7/45 ,  C25D11/02 ,  C25D11/24 ,  C25D11/30

CPC classification number: H05K5/03 ,  C09D5/002 ,  C09D7/41 ,  C09D7/45 ,  C25D11/026 ,  C25D11/30 ,  C25D11/243

Abstract: The present disclosure is drawn to covers for electronic, devices, methods of making the covers, and electronic devices, in one example, described herein Is a cover for an electronic device comprising: a substrate; a micro-arc oxidation layer applied on at least one surface of the substrate; and a dyeing layer on the micro-arc oxidation layer, wherein the dyeing layer comprises: from about 3 to about 10 wt% wafer based dyes based on the total weight of the dyeing layer; and from about 0.3 wt % to about 2 wt% surfactant based on the total weight of the dyeing layer.

公开(公告)号：US20230034431A1

公开(公告)日：2023-02-02

申请号：US17786619

申请日：2020-01-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Chi Hao Chang

IPC: H05K5/06 ,  H05K5/03

Abstract: This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, a cover comprises a substrate comprising a first metal; a second metal injection molded 10 on the surface of the substrate; a paint layer or an electrophoretic deposition layer on the second metal surface; a chamfered edge on the substrate, wherein the chamfered edge cuts through the paint layer or the electrophoretic deposition layer, the second metal, and partially through the first metal; and a hydrophobic coating.

公开(公告)号：US11762427B2

公开(公告)日：2023-09-19

申请号：US17418464

申请日：2019-02-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Chih-Hsiung Liao

IPC: G06F1/16

CPC classification number: G06F1/1656 ,  G06F1/1616

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.

公开(公告)号：US20220007531A1

公开(公告)日：2022-01-06

申请号：US17298648

申请日：2019-07-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Lien-Chia Chiu ,  Ya-Ting Yeh ,  Kuan-Ting Wu

IPC: H05K5/03 ,  B32B15/08 ,  B32B3/02 ,  C25D11/02 ,  C25D11/30 ,  C23C14/16 ,  C23C14/20 ,  C23C14/24 ,  C23C28/00 ,  B05D3/12 ,  B05D1/02 ,  B05D5/06 ,  B05D7/00

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate joined with an insert molding plastic part, and a protective treatment layer on the light metal substrate and the insert molding plastic part. A transparent primer coating on the protective treatment layer, and a paint coating on the transparent primer coating. A milled edge along the insert molding plastic part, wherein the milled edge cuts through the paint coating to expose the transparent primer coating.

公开(公告)号：US10398041B2

公开(公告)日：2019-08-27

申请号：US15746129

申请日：2015-08-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ,  Kuan-Ting Wu ,  Kevin Voss ,  Ya-Ting Yeh

Inventor： Kuan-Ting Wu ,  Kevin Voss ,  Ya-Ting Yeh

IPC: C03C17/42 ,  H05K5/02 ,  B05D3/06 ,  B05D3/10 ,  B05D3/12

Abstract: Various examples provide a method of making a hydrophobic surface for an object. According to the method, a hydrophobic coating may be applied to an original surface of the object. A microstructure may be formed on the original surface of the object. The hydrophobic surface of the object may be obtained with the microstructure submerged by the hydrophobic coating. The microstructure may be a rough structure including micro-sired portions, and may have greater hardness than the hydrophobic coating.

公开(公告)号：US20220276679A1

公开(公告)日：2022-09-01

申请号：US17637476

申请日：2019-11-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Hsing-Hung Hsieh

IPC: G06F1/16 ,  C23C18/12 ,  C23C28/00 ,  C25D11/24

Abstract: Examples of an anti-fingerprint enclosure for an electronic device have been described. In an example, the enclosure comprises an aluminum alloy substrate; a sealing layer deposited on a surface of the aluminum alloy substrate; and a magnesium fluoride sol-gel derived film deposited on the sealing layer, wherein the magnesium fluoride sol-gel derived film exhibits a refractive index of from about 1.36 to about 1.44.

公开(公告)号：US11143937B2

公开(公告)日：2021-10-12

申请号：US16481509

申请日：2017-12-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Ya-Ting Yeh ,  Kuan-Ting Wu ,  Shih-Hsun Huang

IPC: G03B11/04 ,  G03B9/08 ,  H04N5/225 ,  G06F1/16 ,  G03B9/58

Abstract: Examples of shutter assembly are described herein. In an example, the shutter assembly includes an opening having a magnetic rubber-based shutter disposed in the opening. The magnetic rubber-based shutter is slidable along a length of the opening to selectively cover and expose the camera.

公开(公告)号：US12152310B2

公开(公告)日：2024-11-26

申请号：US16978733

申请日：2018-06-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Ya-Ting Yeh ,  Chih-Hsiung Liao

IPC: C25D11/24 ,  C09D5/00 ,  C09D7/20 ,  C09D183/04 ,  C25D11/18 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34 ,  H05K5/04

Abstract: The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.

公开(公告)号：US11920244B2

公开(公告)日：2024-03-05

申请号：US16982694

申请日：2018-07-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chi-Hao Chang ,  Ya-Ting Yeh ,  Kuan-Ting Wu ,  Chih-Hsiung Liao

IPC: C23C28/00 ,  C23C14/16 ,  C25D11/02 ,  C25D11/30 ,  G06F1/16

CPC classification number: C23C28/345 ,  C23C14/16 ,  C23C28/322 ,  C25D11/026 ,  C25D11/30 ,  G06F1/1656

Abstract: The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.