Invention Grant
- Patent Title: Method and apparatus for reducing vacuum loss in an ion implantation system
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Application No.: US17701538Application Date: 2022-03-22
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Publication No.: US11764042B2Publication Date: 2023-09-19
- Inventor: Tsung-Min Lin , Fang-Chi Chien , Cheng-Yi Huang , Chao-Po Lu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01J37/18 ; H01J37/31 ; H01J37/317

Abstract:
A method and apparatus for dosage measurement and monitoring in an ion implantation system is disclosed. In one embodiment, a transferring system, includes: a vacuum chamber, wherein the vacuum chamber is coupled to a processing chamber; a shaft coupled to a ball screw, wherein the ball screw and the shaft are configured in the vacuum chamber; and a vacuum rotary feedthrough, wherein the vacuum rotary feedthrough comprises a magnetic fluid seal so as to provide a high vacuum sealing, and wherein the vacuum rotary feedthrough is configured through a first end of the vacuum chamber and coupled to the ball screw so as to provide a rotary motion on the ball screw.
Public/Granted literature
- US20220216040A1 METHOD AND APPARATUS FOR REDUCING VACUUM LOSS IN AN ION IMPLANTATION SYSTEM Public/Granted day:2022-07-07
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