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公开(公告)号:US11569062B2
公开(公告)日:2023-01-31
申请号:US16882053
申请日:2020-05-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Hom-Chung Lin , Jih-Churng Twu , Yi-Ting Chang , Chao-Po Lu , Tsung-Min Lin
IPC: H01J37/31 , H01J37/317 , H01J37/08 , H01J37/32
Abstract: An ion implantation system includes an ion implanter containing an ion source unit and a dopant source gas supply system. The system includes a dopant source gas storage tank inside a gas box container located remotely to the ion implanter and a dopant source gas supply pipe configured to supply a dopant source gas from the dopant source gas storage tank to the ion source unit. The dopant source gas supply pipe includes an inner pipe, an outer pipe enclosing the inner pipe, a first pipe adaptor coupled to first end of respective inner and outer pipes, and a second pipe adaptor coupled to seconds end of respective inner and outer pipes opposite the first end. The first pipe adaptor connects the inner pipe to the dopant source gas storage tank and the second pipe adaptor connects the inner pipe to the ion source unit.
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公开(公告)号:US20220216040A1
公开(公告)日:2022-07-07
申请号:US17701538
申请日:2022-03-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Tsung-Min LIN , Fang-Chi Chien , Cheng-Yi Huang , Chao-Po Lu
Abstract: A method and apparatus for dosage measurement and monitoring in an ion implantation system is disclosed. In one embodiment, a transferring system, includes: a vacuum chamber, wherein the vacuum chamber is coupled to a processing chamber; a shaft coupled to a ball screw, wherein the ball screw and the shaft are configured in the vacuum chamber; and a vacuum rotary feedthrough, wherein the vacuum rotary feedthrough comprises a magnetic fluid seal so as to provide a high vacuum sealing, and wherein the vacuum rotary feedthrough is configured through a first end of the vacuum chamber and coupled to the ball screw so as to provide a rotary motion on the ball screw.
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公开(公告)号:US11289311B2
公开(公告)日:2022-03-29
申请号:US16588152
申请日:2019-09-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Tsung-Min Lin , Fang-Chi Chien , Cheng-Yi Huang , Chao-Po Lu
IPC: H01J37/18 , H01J37/32 , H01J37/317
Abstract: A method and apparatus for dosage measurement and monitoring in an ion implantation system is disclosed. In one embodiment, a transferring system, includes: a vacuum chamber, wherein the vacuum chamber is coupled to a processing chamber; a shaft coupled to a ball screw, wherein the ball screw and the shaft are configured in the vacuum chamber; and a vacuum rotary feedthrough, wherein the vacuum rotary feedthrough comprises a magnetic fluid seal so as to provide a high vacuum sealing, and wherein the vacuum rotary feedthrough is configured through a first end of the vacuum chamber and coupled to the ball screw so as to provide a rotary motion on the ball screw.
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公开(公告)号:US11764042B2
公开(公告)日:2023-09-19
申请号:US17701538
申请日:2022-03-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Tsung-Min Lin , Fang-Chi Chien , Cheng-Yi Huang , Chao-Po Lu
IPC: H01J37/32 , H01J37/18 , H01J37/31 , H01J37/317
CPC classification number: H01J37/32743 , H01J37/18 , H01J37/32412 , H01J37/3171
Abstract: A method and apparatus for dosage measurement and monitoring in an ion implantation system is disclosed. In one embodiment, a transferring system, includes: a vacuum chamber, wherein the vacuum chamber is coupled to a processing chamber; a shaft coupled to a ball screw, wherein the ball screw and the shaft are configured in the vacuum chamber; and a vacuum rotary feedthrough, wherein the vacuum rotary feedthrough comprises a magnetic fluid seal so as to provide a high vacuum sealing, and wherein the vacuum rotary feedthrough is configured through a first end of the vacuum chamber and coupled to the ball screw so as to provide a rotary motion on the ball screw.
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5.
公开(公告)号:US09527721B2
公开(公告)日:2016-12-27
申请号:US14713243
申请日:2015-05-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shyh-Wei Cheng , Chao-Po Lu , Chung-Hsien Hun , Chih-Shan Chen , Chuan-Yi Ko , Chih-Yu Wang , Hsi-Cheng Hsu , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu
CPC classification number: B81B3/0005 , B81B3/001 , B81B2201/0235 , B81B2207/012 , B81C1/00984 , B81C2203/0109 , B81C2203/0118 , B81C2203/035 , B81C2203/036 , B81C2203/0785 , B81C2203/0792 , H01L2224/81805 , H01L2924/1461 , H01L2924/16235
Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.
Abstract translation: 本公开涉及具有抗静电层的微机电系统(MEMS)封装以及相关联的形成方法。 在一些实施例中,MEMS封装包括器件衬底和CMOS衬底。 器件衬底包括具有相对于器件衬底可移动或柔性的可移动或柔性部件的MEMS器件。 可移动或柔性部分的表面由多晶硅制成的共形抗静电层涂覆。 还提供了一种制造MEMS封装的方法。
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6.
公开(公告)号:US20160332863A1
公开(公告)日:2016-11-17
申请号:US14713243
申请日:2015-05-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shyh-Wei Cheng , Chao-Po Lu , Chung-Hsien Hun , Chih-Shan Chen , Chuan-Yi Ko , Chih-Yu Wang , Hsi-Cheng Hsu , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu
CPC classification number: B81B3/0005 , B81B3/001 , B81B2201/0235 , B81B2207/012 , B81C1/00984 , B81C2203/0109 , B81C2203/0118 , B81C2203/035 , B81C2203/036 , B81C2203/0785 , B81C2203/0792 , H01L2224/81805 , H01L2924/1461 , H01L2924/16235
Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.
Abstract translation: 本公开涉及具有抗静电层的微机电系统(MEMS)封装以及相关联的形成方法。 在一些实施例中,MEMS封装包括器件衬底和CMOS衬底。 器件衬底包括具有相对于器件衬底可移动或柔性的可移动或柔性部件的MEMS器件。 可移动或柔性部分的表面由多晶硅制成的共形抗静电层涂覆。 还提供了一种制造MEMS封装的方法。
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