Invention Grant
- Patent Title: Process apparatus including a non-contact thermo-sensor
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Application No.: US16898965Application Date: 2020-06-11
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Publication No.: US11764087B2Publication Date: 2023-09-19
- Inventor: Chaemook Lim , Yeongrack Son , Ohhyuk Kwon , Dongouk Kim , Youngbum Kim , Woohee Kim , Dongjoon Lee , Kwanghyeon Jeong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20190166604 2019.12.13
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/263 ; H01L21/02

Abstract:
A process apparatus includes a heating module and a supporter disposed below the heating module. A process space is provided between the heating module and the supporter. The heating module includes a housing, at least one heating lamp disposed in the housing, at least one temperature sensor disposed in the housing, and a blocking plate disposed under the housing. The blocking plate spatially separates the at least one heating lamp from the process space, and the blocking plate includes at least one window spatially connecting the at least one temperature sensor to the process space.
Public/Granted literature
- US20210183672A1 PROCESS APPARATUS INCLUDING A NON-CONTACT THERMO-SENSOR Public/Granted day:2021-06-17
Information query
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