公开(公告)号：US11764087B2

公开(公告)日：2023-09-19

申请号：US16898965

申请日：2020-06-11

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Chaemook Lim ,  Yeongrack Son ,  Ohhyuk Kwon ,  Dongouk Kim ,  Youngbum Kim ,  Woohee Kim ,  Dongjoon Lee ,  Kwanghyeon Jeong

IPC分类号： H01L21/67 ,  H01L21/263 ,  H01L21/02

CPC分类号： H01L21/67248 ,  H01L21/02255 ,  H01L21/2636

摘要： A process apparatus includes a heating module and a supporter disposed below the heating module. A process space is provided between the heating module and the supporter. The heating module includes a housing, at least one heating lamp disposed in the housing, at least one temperature sensor disposed in the housing, and a blocking plate disposed under the housing. The blocking plate spatially separates the at least one heating lamp from the process space, and the blocking plate includes at least one window spatially connecting the at least one temperature sensor to the process space.