- 专利标题: Very high speed, high density electrical interconnection system with impedance control in mating region
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申请号: US17107761申请日: 2020-11-30
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公开(公告)号: US11764523B2公开(公告)日: 2023-09-19
- 发明人: Mark W. Gailus , John Robert Dunham , Marc B. Cartier, Jr. , Donald A. Girard, Jr.
- 申请人: Amphenol Corporation
- 申请人地址: US CT Wallingford
- 专利权人: Amphenol Corporation
- 当前专利权人: Amphenol Corporation
- 当前专利权人地址: US CT Wallingford
- 代理机构: Wolf, Greenfield & Sacks, P.C.
- 主分类号: H01R13/6586
- IPC分类号: H01R13/6586 ; H01R12/58 ; H01R13/6474 ; H01R12/70 ; H01R13/6461 ; H01R13/6473 ; H01R13/6585
摘要:
A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. In some embodiments, the modules may have projecting portions, of conductive and/or dielectric material, that are shaped and positioned to reduce changes in impedance along the signal paths as a function of separation of conductive elements, when the connectors are separated by less than the functional mating range.
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