- 专利标题: Three dimensional memory arrays
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申请号: US17187213申请日: 2021-02-26
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公开(公告)号: US11765912B2公开(公告)日: 2023-09-19
- 发明人: Agostino Pirovano , Andrea Redaelli , Fabio Pellizzer , Innocenzo Tortorelli
- 申请人: Micron Technology, Inc.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Brooks, Cameron & Huebsch, PLLC
- 分案原申请号: US15689155 2017.08.29
- 主分类号: H01L27/24
- IPC分类号: H01L27/24 ; H01L27/115 ; H01L45/00 ; H10B63/00 ; H10B69/00 ; H10N70/20 ; H10N70/00
摘要:
In an example, a memory array may include a plurality of first dielectric materials and a plurality of stacks, where each respective first dielectric material and each respective stack alternate, and where each respective stack comprises a first conductive material and a storage material. A second conductive material may pass through the plurality of first dielectric materials and the plurality of stacks. Each respective stack may further include a second dielectric material between the first conductive material and the second conductive material.
公开/授权文献
- US20210183947A1 THREE DIMENSIONAL MEMORY ARRAYS 公开/授权日:2021-06-17
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