Cross-point pillar architecture for memory arrays

    公开(公告)号:US12283316B2

    公开(公告)日:2025-04-22

    申请号:US18409992

    申请日:2024-01-11

    Abstract: Methods, systems, and devices for a cross-point pillar architecture for memory arrays are described. Multiple selector devices may be configured to access or activate a pillar within a memory array, where the selector devices may each be or include a chalcogenide material. A pillar access line may be coupled with multiple selector devices, where each selector device may correspond to a pillar associated with the pillar access line. Pillar access lines on top and bottom of the pillars of the memory array may be aligned in a square or rectangle formation, or in a hexagonal formation. Pillars and corresponding selector devices on top and bottom of the pillars may be located at overlapping portions of the pillar access lines, thereby forming a cross point architecture for pillar selection or activation. The selector devices may act in pairs to select or activate a pillar upon application of a respective selection voltage.

    Memory device and method for operating the same including setting a recovery voltage

    公开(公告)号:US12277967B2

    公开(公告)日:2025-04-15

    申请号:US18586174

    申请日:2024-02-23

    Abstract: A memory device can include a plurality of memory cells including a first group of memory cells and a second group of memory cells programmed to a predefined logic state. The plurality of memory cells includes a memory controller configured to apply a reading voltage to at least one selected memory cell of the first group during a reading operation, apply the reading voltage to the memory cells of the second group, and responsive to the logic state of at least one memory cell of the second group being assessed to be different from the predefined logic state perform a refresh operation of the memory cells of the first group by applying a recovery voltage higher than the reading voltage to assess the logic state thereof and reprogramming the memory cells of the first group to the logic state assessed with the recovery voltage.

    RANDOM NUMBER GENERATION BASED ON THRESHOLD VOLTAGE RANDOMNESS

    公开(公告)号:US20250024761A1

    公开(公告)日:2025-01-16

    申请号:US18782436

    申请日:2024-07-24

    Abstract: Methods, systems, and devices for random number generation based on threshold voltage randomness are described. For example, a memory device may apply a voltage to a chalcogenide element and increase the applied voltage at least until the applied voltage satisfies a threshold voltage associated with the chalcogenide element. The memory device may detect the state of an oscillating signal at a time at which the applied voltage satisfies the threshold voltage, and the memory device may output a logic value corresponding to the state of the oscillating signal. The threshold voltage of the chalcogenide element may vary in a statistically random manner across voltage applications, and hence the state of the oscillating signal at the time an applied voltage reaches the threshold voltage may likewise vary in a statistically random manner, and thus the corresponding logic value that is output may be a random value suitable for random number generation.

    ADAPTIVE WRITE OPERATIONS FOR A MEMORY DEVICE

    公开(公告)号:US20240203468A1

    公开(公告)日:2024-06-20

    申请号:US18593635

    申请日:2024-03-01

    CPC classification number: G11C7/1096 G11C7/1051

    Abstract: Methods, systems, and devices for adaptive write operations for a memory device are described. In an example, the described techniques may include identifying a quantity of access operations performed on a memory array, modifying one or more parameters for a write operation based on the identified quantity of access operations, and writing logic states to the memory array by performing the write operation according to the one or more modified parameters. In some examples, the memory array may include memory cells associated with a configurable material element, such as a chalcogenide material, that stores a logic state based on a material property of the material element. In some examples, the described techniques may at least partially compensate for a change in memory material properties due to aging or other degradation or changes over time (e.g., due to accumulated access operations).

    RANDOM NUMBER GENERATION BASED ON THRESHOLD VOLTAGE RANDOMNESS

    公开(公告)号:US20240057489A1

    公开(公告)日:2024-02-15

    申请号:US17818617

    申请日:2022-08-09

    CPC classification number: H01L45/141 G11C13/003 H01L45/1233

    Abstract: Methods, systems, and devices for random number generation based on threshold voltage randomness are described. For example, a memory device may apply a voltage to a chalcogenide element and increase the applied voltage at least until the applied voltage satisfies a threshold voltage associated with the chalcogenide element. The memory device may detect the state of an oscillating signal at a time at which the applied voltage satisfies the threshold voltage, and the memory device may output a logic value corresponding to the state of the oscillating signal. The threshold voltage of the chalcogenide element may vary in a statistically random manner across voltage applications, and hence the state of the oscillating signal at the time an applied voltage reaches the threshold voltage may likewise vary in a statistically random manner, and thus the corresponding logic value that is output may be a random value suitable for random number generation.

    Capacitive pillar architecture for a memory array

    公开(公告)号:US11729999B2

    公开(公告)日:2023-08-15

    申请号:US17735810

    申请日:2022-05-03

    Abstract: Methods, systems, and devices for a capacitive pillar architecture for a memory array are described. An access line within a memory array may be, include, or be coupled with a pillar. The pillar may include an exterior electrode, such as a hollow exterior electrode, surrounding an inner dielectric material that may further surround an interior, core electrode. The interior electrode may be maintained at a voltage level during at least a portion of an access operation for a memory cell coupled with the pillar. Such a pillar structure may increase a capacitance of the pillar, for example, based on a capacitive coupling between the interior and exterior electrodes. The increased capacitance may provide benefits associated with operating the memory array, such as increased memory cell programming speed, programming reliability, and read disturb immunity.

    CROSS-POINT PILLAR ARCHITECTURE FOR MEMORY ARRAYS

    公开(公告)号:US20230207002A1

    公开(公告)日:2023-06-29

    申请号:US17647578

    申请日:2022-01-10

    Abstract: Methods, systems, and devices for a cross-point pillar architecture for memory arrays are described. Multiple selector devices may be configured to access or activate a pillar within a memory array, where the selector devices may each be or include a chalcogenide material. A pillar access line may be coupled with multiple selector devices, where each selector device may correspond to a pillar associated with the pillar access line. Pillar access lines on top and bottom of the pillars of the memory array may be aligned in a square or rectangle formation, or in a hexagonal formation. Pillars and corresponding selector devices on top and bottom of the pillars may be located at overlapping portions of the pillar access lines, thereby forming a cross point architecture for pillar selection or activation. The selector devices may act in pairs to select or activate a pillar upon application of a respective selection voltage.

    NEURAL NETWORK MEMORY
    10.
    发明申请

    公开(公告)号:US20230058092A1

    公开(公告)日:2023-02-23

    申请号:US17977046

    申请日:2022-10-31

    Abstract: An example apparatus can include a memory array and a memory controller. The memory array can include a first portion including a first plurality of memory cells. The memory array can further include a second portion including a second plurality of memory cells. The memory controller can be coupled to the first portion and the second portion. The memory controller can be configured to operate the first plurality of memory cells for short-term memory operations. The memory controller can be further configured to operate the second plurality of memory cells for long-term memory operations.

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