发明授权
- 专利标题： Thermally conductive moisture-curable resin composition and cured product thereof
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申请号： US16956393申请日： 2019-02-05
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公开(公告)号： US11767451B2公开(公告)日： 2023-09-26
- 发明人: Kentaro Watanabe
- 申请人： THREEBOND CO., LTD.
- 申请人地址： JP Tokyo
- 专利权人： THREEBOND CO., LTD.
- 当前专利权人： THREEBOND CO., LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： LUCAS & MERCANTI, LLP
- 优先权： JP 18024688 2018.02.15
- 国际申请： PCT/JP2019/004007 2019.02.05
- 国际公布： WO2019/159753A 2019.08.22
- 进入国家日期： 2020-06-19
- 主分类号： C09J171/00
- IPC分类号： C09J171/00 ; C09J5/00 ; C09J11/04 ; C09K5/14 ; H05K7/20 ; C09D201/10 ; C08K5/54
摘要：
The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing.
The thermally conductive moisture-curable resin composition contains the following components (A) to (C):
component (A): an organic polymer containing two or more hydrolyzable silyl groups;
component (B): a thermally conductive filler; and
component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.
The thermally conductive moisture-curable resin composition contains the following components (A) to (C):
component (A): an organic polymer containing two or more hydrolyzable silyl groups;
component (B): a thermally conductive filler; and
component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.
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