Invention Grant
- Patent Title: Thermally conductive moisture-curable resin composition and cured product thereof
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Application No.: US16956393Application Date: 2019-02-05
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Publication No.: US11767451B2Publication Date: 2023-09-26
- Inventor: Kentaro Watanabe
- Applicant: THREEBOND CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: THREEBOND CO., LTD.
- Current Assignee: THREEBOND CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: LUCAS & MERCANTI, LLP
- Priority: JP 18024688 2018.02.15
- International Application: PCT/JP2019/004007 2019.02.05
- International Announcement: WO2019/159753A 2019.08.22
- Date entered country: 2020-06-19
- Main IPC: C09J171/00
- IPC: C09J171/00 ; C09J5/00 ; C09J11/04 ; C09K5/14 ; H05K7/20 ; C09D201/10 ; C08K5/54
Abstract:
The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing.
The thermally conductive moisture-curable resin composition contains the following components (A) to (C):
component (A): an organic polymer containing two or more hydrolyzable silyl groups;
component (B): a thermally conductive filler; and
component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.
The thermally conductive moisture-curable resin composition contains the following components (A) to (C):
component (A): an organic polymer containing two or more hydrolyzable silyl groups;
component (B): a thermally conductive filler; and
component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.
Public/Granted literature
- US11879077B2 Thermally conductive moisture-curable resin composition and cured product thereof Public/Granted day:2024-01-23
Information query
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