- 专利标题: Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts
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申请号: US16512589申请日: 2019-07-16
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公开(公告)号: US11768434B2公开(公告)日: 2023-09-26
- 发明人: Katsuya Takemura , Masashi Iio , Hiroyuki Urano , Kazuya Honda
- 申请人: SHIN-ETSU CHEMICAL CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: SHIN-ETSU CHEMICAL CO., LTD.
- 当前专利权人: SHIN-ETSU CHEMICAL CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff PLC
- 优先权: JP 18144831 2018.08.01
- 主分类号: G03F7/023
- IPC分类号: G03F7/023 ; G03F7/40 ; C08G73/10 ; C08G73/14 ; C08G73/22 ; C08G69/26 ; G03F7/004 ; G03F7/039 ; G03F7/038 ; G03F7/16 ; G03F7/20 ; G03F7/32
摘要:
The present invention is a polymer having a polyamide structural unit, a polyamide-imide structural unit, or a polyimide structural unit, selected from a polyamide, a polyamide-imide, a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor, including a reaction product of a diamine containing at least one of a diamine shown by the following general formula (1) and a diamine shown by the following general formula (2), together with at least one of a tetracarboxylic dianhydride shown by the following general formula (3) as well as a dicarboxylic acid and a dicarboxylic halide shown by the following general formula (4). This provides a polymer which is soluble in a safe organic solvent used widely, and is usable as a base resin of a positive photosensitive resin composition that is soluble in an aqueous alkaline solution and capable of forming a fine pattern to give higher resolution.
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