Invention Grant
- Patent Title: Semiconductor device having a metal clip with a solder volume balancing reservoir
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Application No.: US18073090Application Date: 2022-12-01
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Publication No.: US11769748B2Publication Date: 2023-09-26
- Inventor: Thomas Stoek , Michael Stadler , Mohd Hasrul Zulkifli
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- The original application number of the division: US17155241 2021.01.22
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495
Abstract:
A semiconductor device includes a semiconductor die attached to a substrate and a metal clip attached to a side of the semiconductor die facing away from the substrate by a soldered joint. The metal clip has a plurality of slots dimensioned so as to take up at least 10% of a solder paste that reflowed to form the soldered joint. Corresponding methods of production are also described.
Public/Granted literature
- US20230094794A1 SEMICONDUCTOR DEVICE HAVING A METAL CLIP WITH A SOLDER VOLUME BALANCING RESERVOIR Public/Granted day:2023-03-30
Information query
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