Invention Grant
- Patent Title: Deposition mask
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Application No.: US16726996Application Date: 2019-12-26
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Publication No.: US11773477B2Publication Date: 2023-10-03
- Inventor: Yasuhiro Uchida , Koji Kobayashi , Hiromitsu Ochiai
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: BURR PATENT LAW, PLLC
- Priority: JP 18241594 2018.12.25 JP 19233978 2019.12.25
- Main IPC: C23C14/04
- IPC: C23C14/04 ; H10K71/00 ; H10K71/16 ; H10K50/11

Abstract:
A deposition mask includes: a mask body having two or more first through-holes; and a support disposed on the mask body and having a second through-hole located at a position overlapped with the first through-holes in a plan view. The mask body has a first surface located on an opposite side of a side of the support, and a second surface located on the side of the support. An outermost circumference first through-hole, which is located on an outermost circumference in a plan view of the two or more first through-holes located at the position overlapped with the second through-hole in a plan view, includes a first point which is a center of the outermost circumference first through-hole in a plan view; the second through-hole includes a second point on an outline of the second through-hole, the second point being nearest to the first point.
Information query
IPC分类: