Invention Grant
- Patent Title: Apparatus for high pressure connection
-
Application No.: US17270658Application Date: 2019-08-12
-
Publication No.: US11774012B2Publication Date: 2023-10-03
- Inventor: Jon David Tedrow , David Bessems , Wei-Hsun Chen
- Applicant: ASML Netherlands B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: DiBerardino McGovern IP Group LLC
- International Application: PCT/EP2019/071531 2019.08.12
- International Announcement: WO2020/057859A 2020.03.26
- Date entered country: 2021-02-23
- Main IPC: F16L13/02
- IPC: F16L13/02 ; F16L9/02 ; H05G2/00
Abstract:
A conduit suitable for use in a high temperature, high pressure environment, the conduit having an elongate portion made of a first refractory metal and a fitting portion made of a second refractory metal attached to an axial end of the elongate portion. The attachment may be made by welding and the second refractory metal may have a greater yield strength than the first refractory metal.
Public/Granted literature
- US20210262593A1 APPARATUS FOR HIGH PRESSURE CONNECTION Public/Granted day:2021-08-26
Information query
