Invention Grant
- Patent Title: Method and system for measuring geometric parameters of through holes
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Application No.: US17004092Application Date: 2020-08-27
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Publication No.: US11774233B2Publication Date: 2023-10-03
- Inventor: Uta-Barbara Goers , Robert Wendell Sharps
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Amy T. Lang
- Main IPC: G01B7/12
- IPC: G01B7/12 ; G01B11/12 ; G01B7/13 ; G01B11/08 ; B60R1/12
Abstract:
A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.
Information query
