-
公开(公告)号：US20190257765A1
公开(公告)日：2019-08-22
申请号：US16346704
申请日：2017-10-31
Applicant: Corning Incorporated
Inventor： Uta-Barbara Goers , En Hong , Sung-chan Hwang , Ji Hwa Jung , Tae-ho Keem , Philip Robert LeBlanc , Rajeshkannan Palanisamy , Sung-jong Pyo , Correy Robert Ustanik
IPC: G01N21/896 , G02B7/182
Abstract: A method of inspecting defects of a transparent substrate may include: illuminating a transparent substrate; calculating an incidence angle range of light so that a first region where the light meets a first surface of the transparent substrate and a second region where light meets a second surface being opposite the first surface of the transparent substrate do not overlap each other; adjusting an incidence angle according to the incidence angle range; adjusting a position of a first detector so that a first field-of-view of the first detector covers the first region and does not cover the second region; adjusting a position of a second detector so that a second field-of-view of the second detector covers the second region and does not cover the first region; and obtaining a first image of the first region and a second image of the second region from the first and second detector, respectively.
-
公开(公告)号：US09656909B2
公开(公告)日：2017-05-23
申请号：US14972284
申请日：2015-12-17
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burket , Uta-Barbara Goers , Samuel Odei Owusu , Tammy Lynn Petriwsky
IPC: C03C15/00 , H05K1/03 , H05K3/00 , B23K26/00 , C03C23/00 , B23K26/384 , B23K26/362 , B23K26/302 , B23K26/364 , C03B33/02
CPC classification number: C03C15/00 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
-
3.发明申请WORK PIECES AND METHODS OF LASER DRILLING THROUGH HOLES IN SUBSTRATES USING AN EXIT SACRIFICIAL COVER LAYER 有权使用一个出口的绝缘层在基板上通过孔激光钻孔的工作方法和方法公开(公告)号：US20160322291A1
公开(公告)日：2016-11-03
申请号：US15138656
申请日：2016-04-26
Applicant: CORNING INCORPORATED
Inventor： Uta-Barbara Goers
IPC: H01L23/498 , H05K3/00 , H05K3/40 , H01L21/48
CPC classification number: H01L23/49827 , B23K26/0622 , B23K26/18 , B23K26/382 , H01L21/486 , H01L23/49838 , H01L23/49894 , H05K3/002 , H05K3/0029 , H05K3/4038 , H05K2203/1383
Abstract: Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer.
Abstract translation: 公开了在衬底中形成通孔的工件和方法。 在一个实施例中，通过钻孔在衬底中形成通孔的方法包括将出射牺牲覆盖层附着到衬底的激光束出射表面，将激光束相对于衬底定位在预定位置，并对应于期望的 位置，并且通过将激光束重复地脉冲到基板的入射表面并穿过基板的大部分而形成通孔。 该方法还包括通过将激光束重复地脉冲到形成在基板中的通孔中，使得激光束穿过基板的激光束出射表面并进入出射牺牲覆盖层，在出射牺牲覆盖层中形成一个孔。
-
公开(公告)号：US09953912B2
公开(公告)日：2018-04-24
申请号：US15138656
申请日：2016-04-26
Applicant: CORNING INCORPORATED
Inventor： Uta-Barbara Goers
IPC: B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00 , H01L23/498 , B23K26/18 , B23K26/0622 , B23K26/382 , H01L21/48 , H05K3/00 , H05K3/40
CPC classification number: H01L23/49827 , B23K26/0622 , B23K26/18 , B23K26/382 , H01L21/486 , H01L23/49838 , H01L23/49894 , H05K3/002 , H05K3/0029 , H05K3/4038 , H05K2203/1383
Abstract: Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer.
-
公开(公告)号：US20180037487A1
公开(公告)日：2018-02-08
申请号：US15555306
申请日：2016-03-02
Applicant: CORNING INCORPORATED
IPC: C03B13/16
CPC classification number: C03B13/16 , B65H23/32 , B65H2801/61 , C03B13/04
Abstract: A method of selecting a radius of curvature for a conveying structure (22) of a continuous glass processing apparatus for processing a flexible glass ribbon (20) having a thickness of no more than about 0.3 mm is provided. The method includes identifying a thickness of the flexible glass ribbon (20). A predetermined bending stress level is selected that is suitable for the flexible glass ribbon (20) during the processing of the flexible glass ribbon. A radius (R) of curvature is selected for a conveying structure that is suitable for conveying the flexible glass ribbon (20) during the processing of the flexible glass ribbon through the glass processing apparatus based on the predetermined bending stress and at least one of web deflection angle and line tension. The glass processing apparatus is provided including the conveying structure.
-
Patent Agency Ranking
公开(公告)号：US10677739B2
公开(公告)日：2020-06-09
申请号：US16346704
申请日：2017-10-31
Applicant: Corning Incorporated
Inventor： Uta-Barbara Goers , En Hong , Sung-chan Hwang , Ji Hwa Jung , Tae-ho Keem , Philip Robert LeBlanc , Rajeshkannan Palanisamy , Sung-jong Pyo , Correy Robert Ustanik
IPC: G01N21/896 , G02B7/182 , G02B21/18 , G02B21/10
Abstract: A method of inspecting defects of a transparent substrate may include: illuminating a transparent substrate; calculating an incidence angle range of light so that a first region where the light meets a first surface of the transparent substrate and a second region where light meets a second surface being opposite the first surface of the transparent substrate do not overlap each other; adjusting an incidence angle according to the incidence angle range; adjusting a position of a first detector so that a first field-of-view of the first detector covers the first region and does not cover the second region; adjusting a position of a second detector so that a second field-of-view of the second detector covers the second region and does not cover the first region; and obtaining a first image of the first region and a second image of the second region from the first and second detector, respectively.
-
公开(公告)号：US20230174423A1
公开(公告)日：2023-06-08
申请号：US18076849
申请日：2022-12-07
Applicant: CORNING INCORPORATED
CPC classification number: C03C23/007 , C03C3/06 , C03C17/06 , C03C17/004 , C03C2201/02 , C03C2203/52 , C03C2217/25 , C03C2218/32
Abstract: A wafer including a glass substrate is provided. The glass substrate includes a first surface defining a plane and including a surface roughness Ra of approximately 0.3 nm in an outer via region and a second surface. The glass substrate defines a plurality of vias extending from the first surface. The plurality of vias each include an entrance defined by the first surface.
-
公开(公告)号：US10732126B2
公开(公告)日：2020-08-04
申请号：US16346711
申请日：2017-10-31
Applicant: Corning Incorporated
Inventor： Chong Pyung An , Uta-Barbara Goers , En Hong , Sung-chan Hwang , Ji Hwa Jung , Tae-ho Keem , Philip Robert LeBlanc , Hyeong-cheol Lee , Michal Mlejnek , Johannes Moll , Rajeshkannan Palanisamy , Sung-jong Pyo , Amanda Kathryn Thomas , Correy Robert Ustanik
IPC: G01N21/896 , G01N21/958
Abstract: A method of inspecting defects on a transparent substrate may include: selecting a gradient of an illumination optical system so that light incident on the transparent substrate has a first angle; selecting a gradient of a detection optical system so that an optical axis of the detection optical system located over the transparent substrate has a second angle, which is equal to or less than the first angle; adjusting a position of at least one of the illumination optical system, the transparent substrate, and the detection optical system so that a field-of-view of the detection optical system covers a first region where the light meets a first surface of the transparent substrate and does not cover a second region where light meets a second surface of the transparent substrate, the second surface being opposite to the first surface; illuminating the transparent substrate; and detecting light scattered from the transparent substrate.
-
9.发明申请公开(公告)号：US20190277774A1
公开(公告)日：2019-09-12
申请号：US16346711
申请日：2017-10-31
Applicant: Corning Incorporated
Inventor： Chong Pyung An , Uta-Barbara Goers , En Hong , Sung-chan Hwang , Ji Hwa Jung , Tae-ho Keem , Philip Robert LeBlanc , Hyeong-cheol Lee , Michal Mlejnek , Johannes Moll , Rajeshkannan Palanisamy , Sung-jong Pyo , Amanda Kathryn Thomas , Correy Robert Ustanik
IPC: G01N21/896 , G01N21/958
Abstract: A method of inspecting defects on a transparent substrate may include: selecting a gradient of an illumination optical system so that light incident on the transparent substrate has a first angle; selecting a gradient of a detection optical system so that an optical axis of the detection optical system located over the transparent substrate has a second angle, which is equal to or less than the first angle; adjusting a position of at least one of the illumination optical system, the transparent substrate, and the detection optical system so that a field-of-view of the detection optical system covers a first region where the light meets a first surface of the transparent substrate and does not cover a second region where light meets a second surface of the transparent substrate, the second surface being opposite to the first surface; illuminating the transparent substrate; and detecting light scattered from the transparent substrate.
-
公开(公告)号：US20160107925A1
公开(公告)日：2016-04-21
申请号：US14972284
申请日：2015-12-17
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burket , Uta-Barbara Goers , Samuel Odei Owusu , Tammy Lynn Petriwisky
IPC: C03C15/00
CPC classification number: C03C15/00 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
-
-
-
-
-
-
-
-
-
Search Results
16
records
(took 0.014 seconds)
