Invention Grant
- Patent Title: Multilayer electronic component and board having the same mounted thereon
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Application No.: US17955079Application Date: 2022-09-28
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Publication No.: US11776753B2Publication Date: 2023-10-03
- Inventor: Heung Kil Park , Se Hun Park , Hun Gyu Park , Woo Chul Shin , Ji Hong Jo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190086596 2019.07.17
- The original application number of the division: US16776622 2020.01.30
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/005 ; H01G2/06

Abstract:
A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.
Public/Granted literature
- US20230013554A1 MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2023-01-19
Information query