-
公开(公告)号：US20210065983A1
公开(公告)日：2021-03-04
申请号：US16854237
申请日：2020-04-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Se Hun Park , Hun Gyu Park , Tae Hoon Kim , Gu Won Ji
Abstract: A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.
-
公开(公告)号：US11309133B2
公开(公告)日：2022-04-19
申请号：US16860704
申请日：2020-04-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Hun Gyu Park , Se Hun Park , Gu Won Ji
Abstract: The multilayer electronic component includes a capacitor body having first to sixth surfaces; first and second external electrodes including first and second connecting portions, and first and second band portions; first and second connection terminals connected to the first band portion; and third and fourth connection terminals connected to the second band portion. The first and second connection terminals include a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular. The third and fourth connection terminals include a third connection surface facing the second band portion, a fourth connection surface opposing the third connection surface, and a second circumferential surface connecting the third and fourth connection surfaces, a cross section of the second circumferential surface being circular.
-
公开(公告)号：US11133132B2
公开(公告)日：2021-09-28
申请号：US16854237
申请日：2020-04-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Se Hun Park , Hun Gyu Park , Tae Hoon Kim , Gu Won Ji
Abstract: A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.
-
公开(公告)号：US20210076499A1
公开(公告)日：2021-03-11
申请号：US16846806
申请日：2020-04-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Se Hun Park , Hun Gyu Park , Woo Chul Shin , Ji Hong Jo
Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.
-
公开(公告)号：US11488778B2
公开(公告)日：2022-11-01
申请号：US16776622
申请日：2020-01-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Se Hun Park , Hun Gyu Park , Woo Chul Shin , Ji Hong Jo
Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.
-
Patent Agency Ranking
公开(公告)号：US20220030719A1
公开(公告)日：2022-01-27
申请号：US17493569
申请日：2021-10-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Se Hun Park , Hun Gyu Park , Woo Chul Shin , Ji Hong Jo
Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.
-
公开(公告)号：US09815086B2
公开(公告)日：2017-11-14
申请号：US14585195
申请日：2014-12-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Hun Han , Sung Chan Park , Hun Gyu Park , So Jung Cho
IPC: H01L41/04 , B06B1/06 , H01L41/09 , H01L41/313 , B06B1/10
CPC classification number: B06B1/0603 , B06B1/10 , H01L41/0933 , H01L41/313
Abstract: There are provided a vibrator and an electronic device including the same. The vibrator includes: a housing having an internal space; an elastic member having both ends fixed to the housing so as to be disposed in the internal space in a state in which elastic deformation is possible; and a piezoelectric element mounted on one surface of the elastic member, wherein the piezoelectric element is fixed to the elastic member by soldering.
-
公开(公告)号：US11776753B2
公开(公告)日：2023-10-03
申请号：US17955079
申请日：2022-09-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Se Hun Park , Hun Gyu Park , Woo Chul Shin , Ji Hong Jo
Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.
-
公开(公告)号：US11665825B2
公开(公告)日：2023-05-30
申请号：US17493569
申请日：2021-10-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Se Hun Park , Hun Gyu Park , Woo Chui Shin , Ji Hong Jo
CPC classification number: H05K1/181 , H01G2/065 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/111 , H05K2201/09381 , H05K2201/10015 , H05K2201/2045
Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal electrodes; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.
-
公开(公告)号：US11166376B2
公开(公告)日：2021-11-02
申请号：US16846806
申请日：2020-04-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Se Hun Park , Hun Gyu Park , Woo Chul Shin , Ji Hong Jo
Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.016 seconds)
