- 专利标题： Semiconductor package assembly and method of manufacturing the same
-
申请号： US17461947申请日： 2021-08-30
-
公开(公告)号： US11778727B2公开(公告)日： 2023-10-03
- 发明人: Jian-Ting Chen , Cheng-Wei Lu , Kuang-Hua Wang
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H01L23/40
摘要：
A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.
公开/授权文献
信息查询
