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公开(公告)号：US20230066017A1
公开(公告)日：2023-03-02
申请号：US17461947
申请日：2021-08-30
发明人： Jian-Ting Chen , Cheng-Wei Lu , Kuang-Hua Wang
摘要： A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.
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公开(公告)号：US20240345130A1
公开(公告)日：2024-10-17
申请号：US18754177
申请日：2024-06-26
发明人： Jian-Ting Chen , Cheng-Han Huang , Kuang-Hua Wang
CPC分类号： G01R1/0433 , H01R12/7076
摘要： A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.
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公开(公告)号：US12066457B2
公开(公告)日：2024-08-20
申请号：US18316211
申请日：2023-05-11
发明人： Jian-Ting Chen , Cheng-Han Huang , Kuang-Hua Wang
IPC分类号： G01R1/04 , G01R1/02 , G01R1/067 , G01R1/073 , G01R1/20 , G01R31/20 , G01R31/26 , G01R31/28 , H01R12/70
CPC分类号： G01R1/0433 , H01R12/7076
摘要： A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.
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公开(公告)号：US20230363080A1
公开(公告)日：2023-11-09
申请号：US18352267
申请日：2023-07-14
发明人： Jian-Ting Chen , Cheng-Wei Lu , Kuang-Hua Wang
CPC分类号： H05K1/0207 , H01L23/4093 , H05K2201/068
摘要： A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.
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公开(公告)号：US20230280370A1
公开(公告)日：2023-09-07
申请号：US18316211
申请日：2023-05-11
发明人： Jian-Ting Chen , Cheng-Han Huang , Kuang-Hua Wang
CPC分类号： G01R1/0433 , H01R12/7076
摘要： A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.
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公开(公告)号：US11778727B2
公开(公告)日：2023-10-03
申请号：US17461947
申请日：2021-08-30
发明人： Jian-Ting Chen , Cheng-Wei Lu , Kuang-Hua Wang
CPC分类号： H05K1/0207 , H01L23/4093 , H05K2201/068
摘要： A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.
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公开(公告)号：US11693025B2
公开(公告)日：2023-07-04
申请号：US17461967
申请日：2021-08-30
发明人： Jian-Ting Chen , Cheng-Han Huang , Kuang-Hua Wang
CPC分类号： G01R1/0433 , H01R12/7076
摘要： A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.
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公开(公告)号：US20230067209A1
公开(公告)日：2023-03-02
申请号：US17461967
申请日：2021-08-30
发明人： Jian-Ting Chen , Cheng-Han Huang , Kuang-Hua Wang
摘要： A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.
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