- Patent Title: Semiconductor test device and system and test method using the same
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Application No.: US16924971Application Date: 2020-07-09
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Publication No.: US11782085B2Publication Date: 2023-10-10
- Inventor: Meehyun Lim , Sungyeol Kim , Hyungjung Yong , Jinyeong Yun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20190153606 2019.11.26
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L23/00 ; H01L25/065

Abstract:
A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.
Public/Granted literature
- US20210156904A1 SEMICONDUCTOR TEST DEVICE AND SYSTEM AND TEST METHOD USING THE SAME Public/Granted day:2021-05-27
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