Invention Grant
- Patent Title: Multilayer extreme ultraviolet reflectors
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Application No.: US17470624Application Date: 2021-09-09
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Publication No.: US11782337B2Publication Date: 2023-10-10
- Inventor: Wen Xiao , Herng Yau Yoong , Vibhu Jindal
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: G03F1/24
- IPC: G03F1/24

Abstract:
Extreme ultraviolet (EUV) mask blanks, methods of forming EUV mask blanks and production systems therefor are disclosed. The EUV mask blanks comprise a multilayer reflective stack on a substrate. The multilayer reflective stack comprises a trilayer film including a first film, a second film, and a third film. Some EUV mask blanks include an interface layer on one or more of the first film, the second film and the third film. EUV mask blanks described herein have low Zeff and high reflectance over large bandwidth of reflection angle, thereby minimizing the M3D effect, especially for high-NA EUV scanners.
Public/Granted literature
- US20230075471A1 MULTILAYER EXTREME ULTRAVIOLET REFLECTORS Public/Granted day:2023-03-09
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