Invention Grant
- Patent Title: Systems and methods for data placement for in-memory-compute
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Application No.: US17548220Application Date: 2021-12-10
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Publication No.: US11782707B2Publication Date: 2023-10-10
- Inventor: Krishna T. Malladi , Wenqin Huangfu
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: G06F9/30
- IPC: G06F9/30 ; G06F7/57 ; G06F7/53

Abstract:
According to one embodiment, a memory module includes: a memory die including a dynamic random access memory (DRAM) banks, each including: an array of DRAM cells arranged in pages; a row buffer to store values of one of the pages; an input/output (IO) module; and an in-memory compute (IMC) module including: an arithmetic logic unit (ALU) to receive operands from the row buffer or the IO module and to compute an output based on the operands and one of a plurality of ALU operations; and a result register to store the output of the ALU; and a controller to: receive, from a host processor, operands and an instruction; determine, based on the instruction, a data layout; supply the operands to the DRAM banks in accordance with the data layout; and control an IMC module to perform one of the ALU operations on the operands in accordance with the instruction.
Public/Granted literature
- US20220171620A1 SYSTEMS AND METHODS FOR DATA PLACEMENT FOR IN-MEMORY-COMPUTE Public/Granted day:2022-06-02
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