Invention Grant
- Patent Title: Semiconductor package and method for manufacturing the same
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Application No.: US17107585Application Date: 2020-11-30
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Publication No.: US11784110B2Publication Date: 2023-10-10
- Inventor: Chung Hao Chen , Chin-Cheng Kuo
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/768 ; H01L21/56 ; H01L23/31 ; H01L23/00 ; B81B7/00 ; B81B7/02
Abstract:
A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.
Public/Granted literature
- US20210082788A1 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-03-18
Information query
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