公开(公告)号：US10854533B2

公开(公告)日：2020-12-01

申请号：US16277826

申请日：2019-02-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung Hao Chen ,  Chin-Cheng Kuo

IPC: H01L23/48 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  B81B7/00 ,  B81B7/02

Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.

公开(公告)号：US11784110B2

公开(公告)日：2023-10-10

申请号：US17107585

申请日：2020-11-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung Hao Chen ,  Chin-Cheng Kuo

IPC: H01L23/48 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  B81B7/00 ,  B81B7/02

CPC classification number: H01L23/481 ,  B81B7/0032 ,  B81B7/02 ,  H01L21/56 ,  H01L21/76898 ,  H01L23/3128 ,  H01L24/09 ,  H01L24/17 ,  B81B2207/07 ,  B81B2207/093 ,  B81B2207/096

Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.

公开(公告)号：US11806710B2

公开(公告)日：2023-11-07

申请号：US16893150

申请日：2020-06-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiao-Yen Lee ,  Ying-Te Ou ,  Chin-Cheng Kuo ,  Chung Hao Chen

IPC: B01L3/00 ,  H01L23/538 ,  H01L21/02

CPC classification number: B01L3/502738 ,  H01L21/02 ,  H01L23/5386

Abstract: A semiconductor package structure includes a substrate, a die and a conductive structure. The die is disposed on or within the substrate. The die has a first surface facing away from the substrate and includes a sensing region and a pad at the first surface of the die. The first surface of the die has a first edge and a second edge opposite to the first edge. The sensing region is disposed adjacent to the first edge. The pad is disposed away from the first edge. The conductive structure electrically connects the pad and the substrate. The sensing region has a first end distal to the first edge of the first surface of the die. A distance from the first end of the sensing region to a center of the pad is equal to or greater than a distance from the first end of the sensing region to the first edge of the first surface of the die.