A chip package includes a semiconductor substrate, a first light-transmissive sheet, a second light-transmissive sheet, a first antenna layer, and a redistribution layer. The first light-transmissive sheet is disposed over the semiconductor substrate, and has a top surface facing away from semiconductor substrate and an inclined sidewall adjacent to the top surface. The second light-transmissive sheet is disposed over the first light-transmissive sheet. The first antenna layer is disposed between the first light-transmissive sheet and the second light-transmissive sheet. The redistribution layer is disposed on the inclined sidewall of the first light-transmissive sheet, and is in contact with an end of the first antenna layer.