Invention Grant
- Patent Title: Semiconductor package having thin substrate and method of making the same
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Application No.: US17960700Application Date: 2022-10-05
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Publication No.: US11784141B2Publication Date: 2023-10-10
- Inventor: Jun Lu , Long-Ching Wang , Madhur Bobde , Bo Chen , Shuhua Zhou
- Applicant: ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Applicant Address: CA Toronto
- Assignee: ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Current Assignee: ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Current Assignee Address: CA Toronto
- Agent Chen-Chi Lin
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L21/78 ; H01L21/683 ; H01L23/15
Abstract:
A semiconductor package comprises a semiconductor substrate, a first metal layer, an adhesive layer, a second metal layer, a rigid supporting layer, and a plurality of contact pads. A thickness of the semiconductor substrate is equal to or less than 50 microns. A thickness of the rigid supporting layer is larger than the thickness of the semiconductor substrate. A thickness of the second metal layer is larger than a thickness of the first metal layer. A method comprises the steps of providing a device wafer; providing a supporting wafer; attaching the supporting wafer to the device wafer via an adhesive layer; and applying a singulaton process so as to form a plurality of semiconductor packages.
Public/Granted literature
- US20230021687A1 SEMICONDUCTOR PACKAGE HAVING THIN SUBSTRATE AND METHOD OF MAKING THE SAME Public/Granted day:2023-01-26
Information query
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