Invention Grant
- Patent Title: Trenchless single-photon avalanche diodes
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Application No.: US17307323Application Date: 2021-05-04
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Publication No.: US11784196B2Publication Date: 2023-10-10
- Inventor: Ping Zheng , Eng Huat Toh , Kiok Boone Elgin Quek , Kien Seen Daniel Chong , Jing Hua Michelle Tng
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GlobalFoundries Singapore Pte. Ltd.
- Current Assignee: GlobalFoundries Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/146 ; H01L31/107

Abstract:
Structures for a single-photon avalanche diode and methods of forming a structure for a single-photon avalanche diode. The structure includes a semiconductor substrate having a top surface, a semiconductor layer on the top surface of the semiconductor substrate, a light-absorbing layer on a portion of the semiconductor layer, and a doped region in the portion of the semiconductor layer. The doped region is positioned in the portion of the semiconductor layer adjacent to the light-absorbing layer.
Public/Granted literature
- US20220359580A1 TRENCHLESS SINGLE-PHOTON AVALANCHE DIODES Public/Granted day:2022-11-10
Information query
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