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公开(公告)号:US11967664B2
公开(公告)日:2024-04-23
申请号:US17659850
申请日:2022-04-20
Applicant: GlobalFoundries Singapore Pte. Ltd.
Inventor: Ping Zheng , Eng Huat Toh , Cancan Wu , Kiok Boone Elgin Quek
IPC: H01L31/107
CPC classification number: H01L31/1075
Abstract: The present disclosure generally relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to photodiodes such as avalanche photodiodes (APDs) and single photon avalanche diodes (SPADs).
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公开(公告)号:US20230361236A1
公开(公告)日:2023-11-09
申请号:US17662095
申请日:2022-05-05
Applicant: GlobalFoundries Singapore Pte. Ltd.
Inventor: Xinshu Cai , Yongshun Sun , Kiok Boone Elgin Quek , Khee Yong Lim , Shyue Seng Tan , Eng Huat Toh , Thanh Hoa Phung , Cancan Wu
IPC: H01L31/103 , H01L31/18 , H01L31/0224 , H01L27/06 , H01L21/8238
CPC classification number: H01L31/103 , H01L31/1824 , H01L31/022408 , H01L27/0629 , H01L21/823878
Abstract: A structure includes a photodetector including alternating p-type semiconductor layers and n-type semiconductor layers in contact with each other in a stack. Each semiconductor layer includes an extension extending beyond an end of an adjacent semiconductor layer of the alternating p-type semiconductor layers and n-type semiconductor layers. The extensions provide an area for operative coupling to a contact. The extensions can be arranged in a cascading, staircase arrangement, or may extend from n-type semiconductor layers on one side of the stack and from p-type semiconductor layers on another side of the stack. The photodetector can be on a substrate in a first region, and a complementary metal-oxide semiconductor (CMOS) device may be on the substrate on a second region separated from the first region by a trench isolation. The photodetector is capable of detecting and converting near-infrared (NIR) light, e.g., having wavelengths of greater than 0.75 micrometers.
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公开(公告)号:US11784196B2
公开(公告)日:2023-10-10
申请号:US17307323
申请日:2021-05-04
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Ping Zheng , Eng Huat Toh , Kiok Boone Elgin Quek , Kien Seen Daniel Chong , Jing Hua Michelle Tng
IPC: H01L27/00 , H01L27/146 , H01L31/107
CPC classification number: H01L27/1461 , H01L27/1463 , H01L27/14627 , H01L27/14645 , H01L27/14689 , H01L31/107
Abstract: Structures for a single-photon avalanche diode and methods of forming a structure for a single-photon avalanche diode. The structure includes a semiconductor substrate having a top surface, a semiconductor layer on the top surface of the semiconductor substrate, a light-absorbing layer on a portion of the semiconductor layer, and a doped region in the portion of the semiconductor layer. The doped region is positioned in the portion of the semiconductor layer adjacent to the light-absorbing layer.
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公开(公告)号:US20210135095A1
公开(公告)日:2021-05-06
申请号:US16671613
申请日:2019-11-01
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Ping Zheng , Bin Liu , Eng Huat Toh , Shyue Seng Tan , Ruchil Kumar Jain , Kiok Boone Elgin Quek
Abstract: Structures for a Hall sensor and methods of forming a structure for a Hall sensor. The structure includes a semiconductor body having a top surface and a sloped sidewall defining a Hall surface that intersects the top surface. The structure further includes a well in the semiconductor body and multiple contacts in the semiconductor body. The well has a section positioned in part beneath the top surface and in part beneath the Hall surface. Each contact is coupled to the section of the well beneath the top surface of the semiconductor body.
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公开(公告)号:US10991704B2
公开(公告)日:2021-04-27
申请号:US16233165
申请日:2018-12-27
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Xinshu Cai , Shyue Seng Tan , Khee Yong Lim , Kiok Boone Elgin Quek
IPC: H01L27/11521 , H01L27/1156 , H01L29/423 , H01L27/11546 , H01L21/28
Abstract: A memory device may include a substrate, a first gate structure, a mask and a second gate structure. The substrate may include a source region and a drain region at least partially arranged within the substrate, and a channel region arranged between the source region and the drain region. The first gate structure may be at least partially arranged over the channel region, and may include a top surface that may be substantially flat. The mask may be at least partially arranged over the top surface of the first gate structure. The second gate structure may be at least partially arranged over the mask and at least partially arranged adjacent to the first gate structure.
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公开(公告)号:US10762966B2
公开(公告)日:2020-09-01
申请号:US16174318
申请日:2018-10-30
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Xinshu Cai , Shyue Seng Tan , Kiok Boone Elgin Quek
IPC: G11C11/34 , G11C16/10 , G11C16/14 , G11C16/04 , H01L27/11521
Abstract: A device having at least one memory cell over a substrate is provided. The at least one memory cell includes a source region and a drain region in the substrate, and a first gate and a second gate over the substrate. The first and second gates are arranged between the source region and the drain region. The first and second gate are separated by an intergate dielectric. The first gate is configured as a select gate and erase gate of the at least one memory cell, and the second gate is configured as a storage gate of the at least one memory cell. The second gate comprises a floating gate and a control gate over the floating gate. The device further includes source/drain (S/D) contacts extending from the source region and the drain region. The source region and the drain region are coupled to either one of a source line (SL) or a bit line (BL) through the S/D contacts.
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公开(公告)号:US10746694B2
公开(公告)日:2020-08-18
申请号:US16203769
申请日:2018-11-29
Applicant: Globalfoundries Singapore Pte. Ltd.
Inventor: Eng Huat Toh , Bin Liu , Shyue Seng Tan , Kiok Boone Elgin Quek
IPC: H01L27/12 , G01N27/414
Abstract: Integrated circuits and methods of producing the same are provided. In an exemplary embodiment, an integrated circuit includes a detection layer, a substrate, and a transistor having a transistor gate electrode, a transistor source, and a transistor drain. A capacitor gate electrode overlies the substrate, where the capacitor gate electrode and the transistor gate electrode are electrically connected with each other and with the detection layer. A capacitor well is defined within the substrate, and a gate insulator is positioned between the capacitor well and the capacitor gate electrode. A capacitor includes the capacitor gate electrode, the gate insulator, and the capacitor well.
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公开(公告)号:US10707358B2
公开(公告)日:2020-07-07
申请号:US16027363
申请日:2018-07-04
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Wanbing Yi , Juan Boon Tan , Kiok Boone Elgin Quek , Khee Yong Lim , Chim Seng Seet , Rajesh Nair
IPC: H01L31/0216 , H01L23/00
Abstract: A semiconductor device having a substrate with at least one photo-detecting region and at least one bond pad is provided. A first passivation layer is deposited over the substrate and over step portions at the edges of the bond pad and a trench having sidewalls and a bottom surface is formed in the substrate. A light shielding layer is deposited over the first passivation layer and covering the trench sidewalls. The light shielding layer has end portions at the photo-detecting region, at step portions at the edges of the bond pad and at the bottom surface of the trench. A second passivation layer is deposited over the light shielding layer. A third passivation layer is deposited over the end portions of the light shielding layer at the photo-detecting region and at the step portions at edges of the bond pad.
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公开(公告)号:US10374052B2
公开(公告)日:2019-08-06
申请号:US15730745
申请日:2017-10-12
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Shyue Seng Tan , Kiok Boone Elgin Quek , Eng Huat Toh
IPC: H01L29/49 , H01L23/535 , H01L29/51 , H01L29/78 , H01L23/522 , H01L21/28 , H01L29/66
Abstract: A semiconductor device with reduce capacitance coupling effect which can reduce the overall parasitic capacitances is disclosed. The semiconductor device includes a gate sidewall spacer with a negative capacitance dielectric layer with and without a dielectric layer. The semiconductor device may also include a plurality of interlevel dielectric (ILD) with a layer of negative capacitance dielectric layer followed by a dielectric layer disposed in-between metal lines in any ILD and combinations. The negative capacitance dielectric layer includes a ferroelectric material which has calculated and selected thicknesses with desired negative capacitance to provide optimal total overlap capacitance in the circuit component which aims to reduce the overall capacitance coupling effect.
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公开(公告)号:US09735164B2
公开(公告)日:2017-08-15
申请号:US14884747
申请日:2015-10-15
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Ping Zheng , Eng Huat Toh , Kiok Boone Elgin Quek , Yuan Sun
IPC: H01L29/423 , H01L27/112 , H01L29/786 , H01L29/06 , H01L29/66 , B82Y40/00 , B82Y10/00
CPC classification number: H01L27/11206 , B82Y10/00 , B82Y40/00 , H01L23/5252 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/66545 , H01L29/775 , H01L29/7851 , Y10S977/765 , Y10S977/888 , Y10S977/943
Abstract: Devices and methods for forming a device are presented. The method includes providing a substrate prepared with at least a first region for accommodating an anti-fuse based memory cell. A fin structure is formed in the first region. The fin structure includes top and bottom fin portions and includes channel and non-channel regions defined along the length of the fin structure. An isolation layer is formed on the substrate. The isolation layer has a top isolation surface disposed below a top fin surface, leaving the top fin portion exposed. At least a portion of the exposed top fin portion in the channel region is processed to form a sharpened tip profile at top of the fin. A gate having a gate dielectric and a metal gate electrode is formed over the substrate. The gate wraps around the channel region of the fin structure.
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