MOS(metal oxide silicon) controlled thyristor device
Abstract:
A MOS controlled thyristor device according to the concept of the present invention includes a substrate comprising a first surface and a second surface, which face each other, gate patterns disposed on the first surface, a cathode electrode configured to cover the gate patterns, and an anode electrode disposed on the second surface, The substrate includes a lower emitter layer having a first conductive type, a lower base layer having a second conductive type on the lower emitter layer, an upper base region provided in an upper portion of the lower emitter layer and having a first conductive type, wherein the upper base region is configured to expose a portion of a top surface of the lower base layer, an upper emitter region having a second conductive type and provided in an upper portion of the upper base region, a first doped region having a first conductive type and a second doped region surrounded by the first doped region and having a second conductive type, wherein the first and second doped regions are provided in an upper portion of the upper emitter region, and a first doping pattern having a first conductive type, which is provided on one surface of the upper portion of the upper emitter region. The first doping pattern is interposed between the upper base region and the first doped region along a first direction parallel to the top surface of the substrate. The first doping pattern is configured to expose a top surface of the upper emitter region on the other surface of the upper portion of the upper emitter region. Each of the gate patterns is configured to cover portions of an exposed top surface of the lower base layer, an exposed top surface of the upper base layer, an exposed top surface of the upper emitter region, a top surface of the first doping pattern, and a top surface of the first doped region. The cathode electrode is configured to cover portions of top and side surfaces of the gate pattern, a top surface of the second doped region, and a top surface of the first doped region. The first conductive type and the second conductive type are different from each other.
Public/Granted literature
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/70 ...双极器件
H01L29/74 ....晶闸管型器件,如具有四区再生作用的
H01L29/744 .....栅极关断型器件
H01L29/745 ......由场效应关断的
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