发明授权
- 专利标题： Chemical-mechanical polishing particle and polishing slurry composition comprising same
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申请号： US17363105申请日： 2021-06-30
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公开(公告)号： US11787974B2公开(公告)日： 2023-10-17
- 发明人: Weoun Gyuen Moon , Jae Hyun Kim , Kyu Soon Shin , Jong Dai Park , Min Gun Lee , Sung Hoon Jin , Goo Hwa Lee , Gyeong Sook Cho , Jae Hong Yoo
- 申请人： Dongjin Semichem Co., Ltd.
- 申请人地址： KR Incheon
- 专利权人： Dongjin Semichem Co., Ltd.
- 当前专利权人： Dongjin Semichem Co., Ltd.
- 当前专利权人地址： KR Incheon
- 代理机构： United One Law Group LLC
- 代理商 Kongsik Kim; Jhongwoo Peck
- 优先权： KR 20180173796 2018.12.31
- 主分类号： C09G1/02
- IPC分类号： C09G1/02 ; C09K3/14
摘要：
The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.
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