- 专利标题： Processing chamber with annealing mini-environment
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申请号： US16665343申请日： 2019-10-28
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公开(公告)号： US11791176B2公开(公告)日： 2023-10-17
- 发明人: Michael Honan , David Blahnik , Robert Brent Vopat , Jeffrey Blahnik , Charles Carlson
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Servilia Whitney LLC
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/673 ; F27D7/02 ; H01L21/324 ; C30B33/02 ; C30B35/00
摘要：
Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.
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