Invention Grant
- Patent Title: Electronic module
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Application No.: US17242060Application Date: 2021-04-27
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Publication No.: US11792565B2Publication Date: 2023-10-17
- Inventor: Chih Lung Lin , Kuei-Hao Tseng , Kai Hung Wang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H04R1/24
- IPC: H04R1/24 ; H04R1/40 ; H04R3/12 ; H04R1/26
Abstract:
An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. A location of the first transducer is configured to be adjustable with respect to the second transducer.
Public/Granted literature
- US20220345811A1 AUDIO DEVICE AND METHOD OF OPERATING THE SAME Public/Granted day:2022-10-27
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