公开(公告)号：US11817362B2

公开(公告)日：2023-11-14

申请号：US17374748

申请日：2021-07-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pang Yuan Lee ,  Kuei-Hao Tseng ,  Chih Lung Lin

IPC: H01L23/31 ,  H01L23/528 ,  H01L21/768

CPC classification number: H01L23/3178 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/528 ,  H01L2225/06513 ,  H01L2924/151

Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.

公开(公告)号：US11582553B2

公开(公告)日：2023-02-14

申请号：US17242093

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung Lin ,  Kuei-Hao Tseng ,  Kai Hung Wang

IPC: H04R1/40 ,  H04R1/26 ,  H04R3/12 ,  G02C11/00 ,  H04R1/24

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

公开(公告)号：US12245872B2

公开(公告)日：2025-03-11

申请号：US17244876

申请日：2021-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung Lin ,  Kuei-Hao Tseng ,  Te Kao Tsui ,  Kai Hung Wang ,  Hung-I Lin

IPC: A61B5/00 ,  H05K1/02 ,  A61B5/024 ,  A61B5/0531 ,  A61B5/145 ,  A61B5/318 ,  A61B5/369 ,  A61B5/389 ,  A61B5/398

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.

公开(公告)号：US11985479B2

公开(公告)日：2024-05-14

申请号：US18109792

申请日：2023-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung Lin ,  Kuei-Hao Tseng ,  Kai Hung Wang

IPC: H04R1/40 ,  G02C11/00 ,  H04R1/24 ,  H04R1/26 ,  H04R3/12

CPC classification number: H04R1/403 ,  G02C11/10 ,  H04R1/24 ,  H04R1/26 ,  H04R3/12 ,  H04R2201/401

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

公开(公告)号：US11792565B2

公开(公告)日：2023-10-17

申请号：US17242060

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung Lin ,  Kuei-Hao Tseng ,  Kai Hung Wang

IPC: H04R1/24 ,  H04R1/40 ,  H04R3/12 ,  H04R1/26

CPC classification number: H04R1/403 ,  H04R1/24 ,  H04R1/26 ,  H04R3/12 ,  H04R2201/405 ,  H04R2430/20

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. A location of the first transducer is configured to be adjustable with respect to the second transducer.

公开(公告)号：US11477559B2

公开(公告)日：2022-10-18

申请号：US16528338

申请日：2019-07-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Tau Huang ,  Kuei-Hao Tseng ,  Hung-I Lin

IPC: H04R1/10 ,  B81B7/00

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

公开(公告)号：US10408875B2

公开(公告)日：2019-09-10

申请号：US15183253

申请日：2016-06-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Jung Chang ,  Wei-Kai Liao ,  Ming-Ching Lin ,  Kuei-Hao Tseng

IPC: G01R31/02 ,  G01R31/26 ,  G01R31/28

Abstract: A testing system includes a subtractor and a divider. The subtractor is configured to receive a first voltage of a circuit being tested and a second voltage of the circuit, and to derive a difference between the first voltage and the second voltage. The divider is configured to receive the difference between the first voltage and the second voltage, and to derive a resistance of the circuit by dividing (i) the difference between the first voltage and the second voltage by (ii) a difference between a first current applied to the circuit and a second current applied to the circuit. The first voltage is corresponding to the first current, and the second voltage is corresponding to the second current.