Invention Grant
- Patent Title: Lamination system
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Application No.: US17675520Application Date: 2022-02-18
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Publication No.: US11794461B2Publication Date: 2023-10-24
- Inventor: Eun Su Jeon , Kyu Yong Han , Sang Pil Park , Jae Hwan Kim
- Applicant: STI CO., LTD.
- Applicant Address: KR Anseong-si
- Assignee: STI CO., LTD.
- Current Assignee: STI CO., LTD.
- Current Assignee Address: KR Anseong-si
- Agency: KILE PARK REED & HOUTTEMAN PLLC
- Priority: KR 20210053514 2021.04.26
- Main IPC: B32B41/00
- IPC: B32B41/00 ; B32B37/02 ; B32B38/18 ; B32B39/00

Abstract:
Disclosed is a lamination system. A lamination system, which bonds a panel and a bonding target panel to from a panel assembly, according to one embodiment of the present invention may include a transfer which moves along a transfer shuttle and supports any one among the panel, the bonding target panel, and the panel assembly, a bonding chamber which is provided parallel to the transfer shuttle and bonds the panel and the bonding target panel, and a first robot which transfers any one among the panel, the bonding target panel, and the panel assembly between the transfer and the bonding chamber.
Public/Granted literature
- US20220339922A1 LAMINATION SYSTEM Public/Granted day:2022-10-27
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