公开(公告)号：US11794461B2

公开(公告)日：2023-10-24

申请号：US17675520

申请日：2022-02-18

Applicant: STI CO., LTD.

Inventor： Eun Su Jeon ,  Kyu Yong Han ,  Sang Pil Park ,  Jae Hwan Kim

IPC: B32B41/00 ,  B32B37/02 ,  B32B38/18 ,  B32B39/00

CPC classification number: B32B37/02 ,  B32B38/18 ,  B32B39/00 ,  B32B41/00 ,  B32B2309/70

Abstract: Disclosed is a lamination system. A lamination system, which bonds a panel and a bonding target panel to from a panel assembly, according to one embodiment of the present invention may include a transfer which moves along a transfer shuttle and supports any one among the panel, the bonding target panel, and the panel assembly, a bonding chamber which is provided parallel to the transfer shuttle and bonds the panel and the bonding target panel, and a first robot which transfers any one among the panel, the bonding target panel, and the panel assembly between the transfer and the bonding chamber.