Invention Grant
- Patent Title: Sensor devices with gas-permeable cover and associated production methods
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Application No.: US17217488Application Date: 2021-03-30
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Publication No.: US11795053B2Publication Date: 2023-10-24
- Inventor: Rainer Markus Schaller , Klaus Elian , Horst Theuss
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Harrity & Harrity, LLP
- Priority: DE 2020110790.0 2020.04.21
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
A sensor device includes a sensor chip with a micro-electromechanical systems (MEMS) structure, wherein the MEMS structure is arranged at a main surface of the sensor chip, and a gas-permeable cover arranged over the main surface of the sensor chip, which covers the MEMS structure and forms a cavity above the MEMS structure.
Public/Granted literature
- US20210323812A1 SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION METHODS Public/Granted day:2021-10-21
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