Invention Grant
- Patent Title: Piezoelectric pump having a heat-dissipating arrangement
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Application No.: US17363912Application Date: 2021-06-30
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Publication No.: US11795933B2Publication Date: 2023-10-24
- Inventor: Yoshio Yamanaka , Masahiro Sasaki , Kenjiro Okaguchi , Shinichiro Matsumoto , Shizuka Ueda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 19049884 2019.03.18
- Main IPC: F04B39/06
- IPC: F04B39/06 ; F04B39/12 ; F04B45/047 ; F04B43/04 ; F04B45/04 ; F04B53/08

Abstract:
A pump unit (100) includes a plurality of piezoelectric pumps (1), a flow path-defining member (50), and a heat-dissipating part (60). The plurality of piezoelectric pumps (1) each include a first flow path for sucking and discharging of fluid. The flow path-defining member (50) includes a second flow path for connection to the first flow paths in the plurality of piezoelectric pumps (1). Heat generated in the plurality of piezoelectric pumps (1) is dissipated through the heat-dissipating part (60). The heat-dissipating part (60) is disposed between the flow path-defining member (50) and each of the plurality of piezoelectric pumps (1). The heat-dissipating part (60) has through-holes through which the first flow paths are connected to the second flow path.
Public/Granted literature
- US20210324851A1 PUMP UNIT Public/Granted day:2021-10-21
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