Invention Grant
- Patent Title: Method and device for electrically contacting components in a semiconductor wafer
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Application No.: US17440912Application Date: 2020-03-09
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Publication No.: US11796567B2Publication Date: 2023-10-24
- Inventor: Michael Bergler , Roland Zeisel
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: Hauptman Ham, LLP
- Priority: DE 2019107138.0 2019.03.20
- International Application: PCT/EP2020/056208 2020.03.09
- International Announcement: WO2020/187630A 2020.09.24
- Date entered country: 2021-09-20
- Main IPC: G01R1/073
- IPC: G01R1/073 ; G01R1/04

Abstract:
A method for electrically contacting components in a semiconductor wafer includes providing a flexible board comprising a first main surface on which a plurality of conductor tracks are arranged, positioning the board with respect to a semiconductor wafer such that the first main surface of the board faces the semiconductor wafer, the board is bent and pressed onto the semiconductor wafer in such a way that contact elements of a plurality of components arranged in a row in the semiconductor wafer come into contact with the conductor tracks, and electrical signals are applied to the components through the conductor tracks.
Public/Granted literature
- US20220163564A1 METHOD AND DEVICE FOR ELECTRICALLY CONTACTING COMPONENTS IN A SEMICONDUCTOR WAFER Public/Granted day:2022-05-26
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