公开(公告)号：US11796567B2

公开(公告)日：2023-10-24

申请号：US17440912

申请日：2020-03-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Bergler ,  Roland Zeisel

IPC: G01R1/073 ,  G01R1/04

CPC classification number: G01R1/0735 ,  G01R1/0491

Abstract: A method for electrically contacting components in a semiconductor wafer includes providing a flexible board comprising a first main surface on which a plurality of conductor tracks are arranged, positioning the board with respect to a semiconductor wafer such that the first main surface of the board faces the semiconductor wafer, the board is bent and pressed onto the semiconductor wafer in such a way that contact elements of a plurality of components arranged in a row in the semiconductor wafer come into contact with the conductor tracks, and electrical signals are applied to the components through the conductor tracks.

公开(公告)号：US11378590B2

公开(公告)日：2022-07-05

申请号：US17282622

申请日：2019-10-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Bergler ,  Roland Zeisel

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/26

Abstract: A device for processing a multiplicity of semiconductor chips in a wafer assemblage includes an electrically conductive carrier for contacting rear contacts of the semiconductor chips, an electrically conductive film for contacting front contacts of the semiconductor chips that are situated opposite the rear contacts, and a squeegee, which is displaceable relative to the film and is configured to press a region of the film in the direction toward the carrier.