Invention Grant
- Patent Title: Power supply assembly with fan assembly for electronic device
-
Application No.: US17127826Application Date: 2020-12-18
-
Publication No.: US11797065B2Publication Date: 2023-10-24
- Inventor: John Aguirre , Youlin Jin , Ralph Remsburg , Guillermo Padin Rohena , Evan Francis Rynk , Carlos Julio Suate Pedroza , Gary Quartana, Jr. , Bradley Fraser , Haney Awad , William Wheeler , Shigeru Natsume
- Applicant: Magic Leap, Inc.
- Applicant Address: US FL Plantation
- Assignee: MAGIC LEAP, INC.
- Current Assignee: MAGIC LEAP, INC.
- Current Assignee Address: US FL Plantation
- Agency: SEED IP LAW GROUP LLP
- Main IPC: G06F1/18
- IPC: G06F1/18 ; G06F1/16 ; G06F1/20 ; H05K7/20 ; H05K7/14 ; G06T19/00 ; G02B27/01 ; G06F3/01 ; F04D29/60 ; F04D25/06 ; F04D29/58 ; F04D29/42

Abstract:
A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.
Public/Granted literature
- US20210240236A1 POWER SUPPLY ASSEMBLY WITH FAN ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2021-08-05
Information query