- Patent Title: Method for substrate registration and anchoring in inkjet printing
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Application No.: US17735018Application Date: 2022-05-02
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Publication No.: US11798831B2Publication Date: 2023-10-24
- Inventor: Daihua Zhang , Hou T. Ng , Nag B. Patibandla , Sivapackia Ganapathiappan , Yingdong Luo , Kyuil Cho , Han-Wen Chen
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- The original application number of the division: US16838999 2020.04.02
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/67 ; H01L21/02
Abstract:
A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.
Public/Granted literature
- US20220336246A1 METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING Public/Granted day:2022-10-20
Information query
IPC分类:
